Invention Grant
- Patent Title: Shared base plate and semiconductor module provided with same
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Application No.: US16975195Application Date: 2018-04-25
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Publication No.: US11626347B2Publication Date: 2023-04-11
- Inventor: Takashi Nagao , Kensuke Takeuchi
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Agent Richard C. Turner
- International Application: PCT/JP2018/016734 WO 20180425
- International Announcement: WO2019/207664 WO 20191031
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/00 ; H01L25/18 ; H02M7/48

Abstract:
A shared base plate includes a plurality of base portions to which a plurality of electronic components including semiconductor switching elements are to be mounted, and a terminal formed portion formed so as to extend from the base portion to the outer side. The terminal formed portion includes a discrimination terminal which is used as a terminal in one of a first semiconductor module and a second semiconductor module and which is not used as a terminal in the other one. If the discrimination terminal that is not used as a terminal is cut to be short, it becomes possible to easily discriminate the semiconductor module from another semiconductor module having the shared base plate by outer appearances.
Information query
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