Invention Grant
- Patent Title: Cutting a leadframe assembly with a plurality of punching tools
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Application No.: US16839216Application Date: 2020-04-03
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Publication No.: US11626350B2Publication Date: 2023-04-11
- Inventor: Chong Han Lim , Lee Han Meng@Eugene Lee , Anis Fauzi Bin Abdul Aziz , Wei Fen Sueann Lim , Siew Kee Lee
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Dawn Jos; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56 ; H01L21/78 ; H01L23/31 ; H01L21/00 ; H01L25/075 ; H01L21/60
Abstract:
A method includes forming a leadframe assembly to have a pair of opposing sides, and having semiconductor die receiving portions extending between the opposing sides. The method also includes placing semiconductor dies on the leadframe assembly in the die receiving portions. Each die has a row of leads on each of two opposing sides of the die and a longitudinal axis parallel to the rows of leads. The longitudinal axis of each die is orthogonal to the opposing sides of the leadframe assembly. The method further includes applying mold compound to the semiconductor dies. The method includes punching through the leadframe assembly between the opposing sides using a first tool having a first tool longitudinal axis parallel to longitudinal axes of the dies.
Public/Granted literature
- US20210202356A1 LEADFRAME ASSEMBLY Public/Granted day:2021-07-01
Information query
IPC分类:
