Invention Grant
- Patent Title: 3D electrical integration using component carrier edge connections to a 2D contact array
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Application No.: US17333890Application Date: 2021-05-28
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Publication No.: US11626357B2Publication Date: 2023-04-11
- Inventor: Roy J. Henson , Shawn O. Powell
- Applicant: FormFactor, Inc.
- Applicant Address: US CA Livermore
- Assignee: FormFactor, Inc.
- Current Assignee: FormFactor, Inc.
- Current Assignee Address: US CA Livermore
- Agency: Lumen Patent Firm
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/065 ; H01L23/13 ; H01L23/538 ; H05K1/18 ; H01R12/52
Abstract:
3D electrical integration is provided by connecting several component carriers to a single substrate using contacts at the edges of the component carriers making contact to a 2D contact array (e.g., a ball grid array or the like) on the substrate. The resulting integration of components on the component carriers is 3D, thereby providing much higher integration density than in 2D approaches.
Public/Granted literature
- US20210375733A1 3D electrical integration using component carrier edge connections to a 2D contact array Public/Granted day:2021-12-02
Information query
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