- Patent Title: Semiconductor device package and method for manufacturing the same
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Application No.: US17486829Application Date: 2021-09-27
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Publication No.: US11626360B2Publication Date: 2023-04-11
- Inventor: Chang-Lin Yeh
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/498 ; H01L25/16
Abstract:
A semiconductor device package includes a first substrate, a second substrate, a conductive structure, a first solder and a second solder. The second substrate is disposed over the first substrate. The conductive structure is disposed between the first substrate and the second substrate. The conductive structure includes a first wetting portion, a second wetting portion, and a non-wetting portion disposed between the first wetting portion and the second wetting portion. The first solder covers the first wetting portion and connects the conductive structure to the first substrate. The second solder covers the second wetting portion and connects the conductive structure to the second substrate. The first solder is spaced apart from the second solder by the non-wetting portion.
Public/Granted literature
- US20220013443A1 SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-01-13
Information query
IPC分类:
