Invention Grant
- Patent Title: Co-integrated vertically structured capacitive element and fabrication process
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Application No.: US17226324Application Date: 2021-04-09
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Publication No.: US11626365B2Publication Date: 2023-04-11
- Inventor: Abderrezak Marzaki , Arnaud Regnier , Stephan Niel
- Applicant: STMicroelectronics (Rousset) SAS , STMicroelectronics (Crolles 2) SAS
- Applicant Address: FR Rousset; FR Crolles
- Assignee: STMicroelectronics (Rousset) SAS,STMicroelectronics (Crolles 2) SAS
- Current Assignee: STMicroelectronics (Rousset) SAS,STMicroelectronics (Crolles 2) SAS
- Current Assignee Address: FR Rousset; FR Crolles
- Agency: Crowe & Dunlevy
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L49/02 ; H01L27/11524

Abstract:
First and second wells are formed in a semiconductor substrate. First and second trenches in the first second wells, respectively, each extend vertically and include a central conductor insulated by a first insulating layer. A second insulating layer is formed on a top surface of the semiconductor substrate. The second insulating layer is selectively thinned over the second trench. A polysilicon layer is deposited on the second insulating layer and then lithographically patterned to form: a first polysilicon portion over the first well that is electrically connected to the central conductor of the first trench to form a first capacitor plate, a second capacitor plate formed by the first well; and a second polysilicon portion over the second well forming a floating gate electrode of a floating gate transistor of a memory cell having an access transistor whose control gate is formed by the central conductor of the second trench.
Public/Granted literature
- US20210225757A1 CO-INTEGRATED VERTICALLY STRUCTURED CAPACITIVE ELEMENT AND FABRICATION PROCESS Public/Granted day:2021-07-22
Information query
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