Invention Grant
- Patent Title: Image sensor package
-
Application No.: US17530358Application Date: 2021-11-18
-
Publication No.: US11626434B2Publication Date: 2023-04-11
- Inventor: Wei-Feng Lin , Ying-Chih Kuo , Ying Chung
- Applicant: OMNIVISION TECHNOLOGIES, INC.
- Applicant Address: US CA Santa Clara
- Assignee: OMNIVISION TECHNOLOGIES, INC.
- Current Assignee: OMNIVISION TECHNOLOGIES, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: COJK/OmniVision Technologies, Inc.
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A method of image sensor package fabrication includes forming a recess in a transparent substrate, depositing conductive traces in the recess, inserting an image sensor in the recess so that the image sensor is positioned in the recess to receive light through the transparent substrate, and inserting a circuit board in the recess so that the image sensor is positioned between the transparent substrate and the circuit board.
Public/Granted literature
- US20220077210A1 IMAGE SENSOR PACKAGE Public/Granted day:2022-03-10
Information query
IPC分类:
