A thin film resistor (TFR) module is formed in an integrated circuit device. The TFR module includes a TFR element connected between first and second vertically-extending TFR side contacts. The TFR element includes a base portion extending laterally between the TFR side contacts, and first and second TFR element end flanges projecting vertically from opposing ends of the base portion. The first TFR element end flange is formed on a sidewall of the first TFR side contact, and the second TFR element end flange is formed on a sidewall of the second TFR side contact. A first TFR head contacts the first TFR side contact and a top of the first TFR element end flange, and a second TFR head contacts the second TFR side contact and a top of the second TFR element end flange, thus defining two parallel conductive paths between the TFR element and each TFR head.