Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17524259Application Date: 2021-11-11
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Publication No.: US11626499B2Publication Date: 2023-04-11
- Inventor: Wonkeun Chung , Heonbok Lee , Chunghwan Shin , Youngsuk Chai , Sangjin Hyun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2018-0072891 20180625
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L27/092 ; H01L29/423 ; H01L29/78 ; H01L29/66

Abstract:
A semiconductor device includes a substrate having an active pattern therein, a gate electrode extending across the active pattern and a source/drain region on the active pattern laterally adjacent the gate electrode. The device further includes a contact structure including a first contact on the source/drain region, a second contact on the first contact and a spacer on sidewalls of the first and second contacts.
Public/Granted literature
- US20220077295A1 SEMICONDUCTOR DEVICE Public/Granted day:2022-03-10
Information query
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