Invention Grant
- Patent Title: Fin field effect transistor (FinFET) device structure
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Application No.: US17084033Application Date: 2020-10-29
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Publication No.: US11626504B2Publication Date: 2023-04-11
- Inventor: Sai-Hooi Yeong , Chi-On Chui , Bo-Feng Young , Bo-Yu Lai , Kuan-Lun Cheng , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/08

Abstract:
A FinFET device structure is provided. The FinFET device structure includes a fin structure formed over a substrate, and a gate structure formed over the fin structure. The FinFET device structure also includes an epitaxial source/drain (S/D) structure formed over the fin structure. A top surface and a sidewall of the fin structure are surrounded by the epitaxial S/D structure. A first distance between an outer surface of the epitaxial S/D structure and the sidewall of the fin structure is no less than a second distance between the outer surface of the epitaxial S/D structure and the top surface of the fin structure.
Public/Granted literature
- US20210043751A1 FIN FIELD EFFECT TRANSISTOR (FINFET) DEVICE STRUCTURE Public/Granted day:2021-02-11
Information query
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