Invention Grant
- Patent Title: Electrostatic discharge protection devices and methods for fabricating electrostatic discharge protection devices
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Application No.: US17149766Application Date: 2021-01-15
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Publication No.: US11626512B2Publication Date: 2023-04-11
- Inventor: Jie Zeng , Milova Paul , Sagar Premnath Karalkar
- Applicant: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Applicant Address: SG Singapore
- Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee: GLOBALFOUNDRIES Singapore Pte. Ltd.
- Current Assignee Address: SG Singapore
- Agency: Viering Jentschura & Partner mbB
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L29/66 ; H01L29/74 ; H01L29/747

Abstract:
An ESD protection device may include a substrate having first and second substrate layers, and first and second bridged regions. Each substrate layer may include first and second border regions and a middle region laterally therebetween. Each bridged region may be arranged within the middle region and a respective border region of the second substrate layer. The middle region of the second substrate layer may be laterally narrower than the middle region of the first substrate layer. Each border region of the second substrate layer may be partially arranged over the middle region of the first substrate layer and partially arranged over a respective border region of the first substrate layer. The border regions of the substrate layers, and the bridged regions may have a first conductivity type, and the middle regions of the substrate layers may have a second conductivity type different from the first conductivity type.
Public/Granted literature
Information query
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