Invention Grant
- Patent Title: FinFET device and methods of forming the same
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Application No.: US17121186Application Date: 2020-12-14
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Publication No.: US11626518B2Publication Date: 2023-04-11
- Inventor: Shahaji B. More , Shih-Chieh Chang , Cheng-Han Lee
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/66 ; H01L29/10 ; H01L29/08 ; H01L27/092 ; H01L29/423 ; H01L21/768 ; H01L21/8238 ; H01L21/225 ; H01L29/161

Abstract:
A semiconductor device includes a substrate; a fin protruding above the substrate, the fin including a compound semiconductor material that includes a semiconductor material and a first dopant, the first dopant having a different lattice constant than the semiconductor material, where a concentration of the first dopant in the fin changes along a first direction from an upper surface of the fin toward the substrate; a gate structure over the fin; a channel region in the fin and directly under the gate structure; and source/drain regions on opposing sides of the gate structure, the source/drain regions including a second dopant, where a concentration of the second dopant at a first location within the channel region is higher than that at a second location within the channel region, where the concentration of the first dopant at the first location is lower than that at the second location.
Public/Granted literature
- US20210193830A1 FinFET Device and Methods of Forming the Same Public/Granted day:2021-06-24
Information query
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