Invention Grant
- Patent Title: Buried contact layer for UV emitting device
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Application No.: US17659239Application Date: 2022-04-14
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Publication No.: US11626535B2Publication Date: 2023-04-11
- Inventor: Johnny Cai Tang , Chun To Lee , Guilherme Tosi , Christopher Flynn , Liam Anderson , Timothy William Bray , Petar Atanackovic
- Applicant: Silanna UV Technologies Pte Ltd
- Applicant Address: SG Singapore
- Assignee: Silanna UV Technologies Pte Ltd
- Current Assignee: Silanna UV Technologies Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: MLO, a professional corp.
- Main IPC: H01L33/06
- IPC: H01L33/06 ; H01L33/38 ; H01L33/00 ; H01L33/32 ; H01L33/14 ; H01L33/12

Abstract:
In some embodiments, a light emitting structure comprises a layered semiconductor stack comprising a first set of doped layers, a second layer, a light emitting layer positioned between the first set of doped layers and the second layer, and an electrical contact to the first set of doped layers. The first set of doped layers can comprise a first sub-layer, a second sub-layer, and a third sub-layer, wherein the third sub-layer is adjacent to the light emitting layer. The electrical contact can be coupled to the second sub-layer. The first, second and third sub-layers can be doped n-type, and an electrical conductivity of the second sub-layer can be higher than an electrical conductivity of the first and third sub-layers. The first, second and third sub-layers, and the light emitting layer can each comprise a superlattice. The second layer can comprise a chirped superlattice.
Public/Granted literature
- US20220238754A1 BURIED CONTACT LAYER FOR UV EMITTING DEVICE Public/Granted day:2022-07-28
Information query
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