Invention Grant
- Patent Title: Semiconductor light-emitting element and method of manufacturing semiconductor light-emitting element
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Application No.: US17012973Application Date: 2020-09-04
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Publication No.: US11626540B2Publication Date: 2023-04-11
- Inventor: Noritaka Niwa , Tetsuhiko Inazu
- Applicant: NIKKISO CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: NIKKISO CO., LTD.
- Current Assignee: NIKKISO CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: JPJP2019-198541 20191031
- Main IPC: H01L33/38
- IPC: H01L33/38 ; H01L33/44 ; H01L33/32 ; H01L33/00 ; H01L33/40 ; H01L33/14

Abstract:
A semiconductor light-emitting element includes: an n-type semiconductor layer; an active layer; a p-side contact electrode made of Rh; a p-side electrode covering layer made of Ti or TiN that covers the p-side contact electrode; a first protective layer made of SiO2 or SiON that covers an upper surface and a side surface of the p-side electrode covering layer in a portion different from that of a first p-side pad opening; a second protective layer made of Al2O3 that covers the first protective layer, a side surface of a p-side semiconductor layer, and a side surface of the active layer in a portion different from that of a second p-side pad opening; and a p-side pad electrode that is in contact with the p-side electrode covering layer in the first p-side pad opening and the second p-side pad opening.
Public/Granted literature
- US20210135058A1 SEMICONDUCTOR LIGHT-EMITTING ELEMENT AND METHOD OF MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING ELEMENT Public/Granted day:2021-05-06
Information query
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