Provided is an LED package and a method for manufacturing the same wherein, if its sealing resin containing phosphor particles each having a coating layer is cut or ground, age deterioration of the phosphor particles in the cut or ground surface is prevented. The method includes: mounting LED elements on a substrate; filling a first resin on the substrate to seal the LED elements, the first resin being transparent or translucent and containing wavelength conversion particles configured by forming a coating layer on at least part of the surface of each phosphor particle which converts the wavelength of light emitted from the LED elements; cutting or grinding the first resin; and forming a protective layer with a second resin on a cut surface of the first resin exposed as a result of the cutting or on a ground surface of the first resin, the second resin not containing the wavelength conversion particles.