Invention Grant
- Patent Title: Light-emitting apparatus and manufacturing method thereof
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Application No.: US17322845Application Date: 2021-05-17
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Publication No.: US11626553B2Publication Date: 2023-04-11
- Inventor: Chung En Peng , Chung-Chan Liu
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW109134521 20201006
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/36

Abstract:
A light-emitting apparatus including a circuit substrate and a light-emitting device is provided. The circuit substrate includes a first electrode and a second electrode. The light-emitting device is disposed on a first surface of the circuit substrate. The light-emitting device includes a first conductive terminal and a second conductive terminal. The first conductive terminal and the second conductive terminal are embedded between the first electrode and the second electrode. In a first direction, there is a first distance between an inner edge of the first electrode and an inner edge of the second electrode, there is a second distance between an outer edge of the first conductive terminal and an outer edge of the second conductive terminal, and the first distance is greater than or equal to the second distance.
Public/Granted literature
- US20220109090A1 LIGHT-EMITTING APPARATUS AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-04-07
Information query
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