Invention Grant
- Patent Title: Connector for high-speed transmission and method for fixing solder to fork portion of connector for high-speed transmission
-
Application No.: US17116245Application Date: 2020-12-09
-
Publication No.: US11626678B2Publication Date: 2023-04-11
- Inventor: Toshiyasu Ito , Yosuke Takai , Taichi Enjoji
- Applicant: Yamaichi Electronics Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee: Yamaichi Electronics Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Hayes Soloway PC
- Priority: CN201911264646.X 20191211,CN201911264665.2 20191211,CN201911264975.4 20191211
- Main IPC: H01R13/187
- IPC: H01R13/187 ; H01R13/24 ; H01R12/71 ; H01R13/514 ; H01R13/6461

Abstract:
According to an embodiment of the present disclosure, a connector for high-speed transmission to be fitted with an external counterpart connector includes a housing and a plurality of terminals. The housing has at least one or more slots. The plurality of terminals includes ground terminals and signal terminals are arranged in the slot along a first direction orthogonal to a fitting direction of the connector. Partition walls are provided between adjacent terminals in the slot, and a height of the partition walls between the ground terminals and the signal terminals in the fitting direction is lower than a height of other partition walls in the fitting direction.
Public/Granted literature
Information query