Invention Grant
- Patent Title: Substrate processing apparatus, and temperature control method
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Application No.: US17240195Application Date: 2021-04-26
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Publication No.: US11626818B2Publication Date: 2023-04-11
- Inventor: Hideto Saito
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2020-081397 20200501
- Main IPC: H02N13/00
- IPC: H02N13/00 ; F28F27/00 ; H01L21/67 ; H01L21/683 ; C23C16/46

Abstract:
A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.
Public/Granted literature
- US20210344288A1 SUBSTRATE PROCESSING APPARATUS, STAGE, AND TEMPERATURE CONTROL METHOD Public/Granted day:2021-11-04
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