Invention Grant
- Patent Title: Electronic devices having circuitry in housing attachment structures
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Application No.: US17326214Application Date: 2021-05-20
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Publication No.: US11626898B2Publication Date: 2023-04-11
- Inventor: James G. Horiuchi , Tyler S. Bushnell , Brad G. Boozer , Mario Martinis , YoungHoon Kim
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Treyz Law Group, P.C.
- Agent G. Victor Treyz; Tianyi He
- Main IPC: H04B1/3827
- IPC: H04B1/3827 ; H01Q1/24 ; G06F3/044 ; H01Q1/27

Abstract:
An electronic device housing may be formed from housing members. A first housing member may form a display cover layer that overlaps pixels. During operation, the pixels may display an image that is viewable through the display cover layer. The second housing member may have a rear wall portion and a sidewall. A band may be coupled to the sidewall or other portion of the second housing member. The first and second housing members may be attached together using a housing member attachment structure. The housing member attachment structure may have layers of adhesive and printed circuit structures. The printed circuit structures may include metal traces that form an antenna and that form capacitive force sensor electrodes on opposing sides of a compressible member.
Public/Granted literature
- US20210273671A1 Electronic Devices Having Circuitry in Housing Attachment Structures Public/Granted day:2021-09-02
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