Invention Grant
- Patent Title: Photosensitive assembly and camera module and manufacturing method thereof
-
Application No.: US17540642Application Date: 2021-12-02
-
Publication No.: US11627239B2Publication Date: 2023-04-11
- Inventor: Mingzhu Wang , Zhenyu Chen , Takehiko Tanaka , Zhongyu Luan , Bojie Zhao , Zhen Huang , Nan Guo , Fengsheng Xi , Heng Jiang , Zilong Deng
- Applicant: Ningbo Sunny Opotech Co., Ltd.
- Applicant Address: CN Zhejiang
- Assignee: Ningbo Sunny Opotech Co., Ltd.
- Current Assignee: Ningbo Sunny Opotech Co., Ltd.
- Current Assignee Address: CN Zhejiang
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: CN201610516600.2 20160703,CN201620691699.5 20160703
- Main IPC: H04N5/225
- IPC: H04N5/225
Abstract:
A camera module and its photosensitive assembly and manufacturing method thereof are provided. The photosensitive assembly includes a photosensitive element, a window circuit board and a packaging body integrally packaged the photosensitive element and the window circuit board to form an integrated body, wherein the window circuit board has at least one window for receiving the photosensitive element therein.
Public/Granted literature
- US20220094822A1 PHOTOSENSITIVE ASSEMBLY AND CAMERA MODULE AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-03-24
Information query
