Invention Grant
- Patent Title: Stretchable conductive substrate
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Application No.: US17393703Application Date: 2021-08-04
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Publication No.: US11627657B2Publication Date: 2023-04-11
- Inventor: Chain-Shu Hsu , Wen-Chang Fan , Chia-Pin Wang
- Applicant: National Yang Ming Chiao Tung University
- Applicant Address: TW Hsinchu
- Assignee: National Yang Ming Chiao Tung University
- Current Assignee: National Yang Ming Chiao Tung University
- Current Assignee Address: TW Hsinchu
- Agency: Li & Cai Intellectual Property (USA) Office
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09

Abstract:
A stretchable conductive substrate includes a substrate and a circuit layer. The substrate has a plurality of predetermined areas. The circuit layer is formed on the substrate and defines a conductive contact group and at least one elastic wire structure connected to the conductive contact group in each of the predetermined areas. The at least one elastic wire structure has at least one patterned wire segment and a stretch rate thereof along a length direction of the substrate is from 0% to 60%.
Public/Granted literature
- US20230042692A1 STRETCHABLE CONDUCTIVE SUBSTRATE Public/Granted day:2023-02-09
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