Invention Grant
- Patent Title: Electronic device and manufacturing method thereof
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Application No.: US17507756Application Date: 2021-10-21
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Publication No.: US11627666B2Publication Date: 2023-04-11
- Inventor: Chun-Hsien Lin
- Applicant: InnoLux Corporation
- Applicant Address: TW Miao-Li County
- Assignee: InnoLux Corporation
- Current Assignee: InnoLux Corporation
- Current Assignee Address: TW Miao-Li County
- Agent Winston Hsu
- Priority: CN202011186128.3 20201029,CN202111164135.8 20210930
- Main IPC: H05K3/30
- IPC: H05K3/30 ; H05K1/18 ; H01L25/075 ; H01L33/00 ; H01L33/24

Abstract:
An electronic device is provided, the electronic device includes a driving substrate (13), the driving substrate includes a plurality of circular grooves and a plurality of rectangular grooves, and a plurality of disc-shaped electronic components, at least one disc-shaped electronic component is disposed in at least one circular groove, an alignment element positioned on a top surface of the at least one disc-shaped electronic component, a diameter of the at least one disc-shaped electronic component is defined as R, a diameter of the alignment element is defined as r, a width of at least one rectangular groove among the rectangular grooves is defined as w, and a height of the at least one rectangular groove is defined as H, and the disc-shaped electronic component and the rectangular groove satisfy the condition of (R+r)/2>(w2+H2)1/2.
Public/Granted literature
- US20220141964A1 Electronic device and manufacturing method thereof Public/Granted day:2022-05-05
Information query