Invention Grant
- Patent Title: Method for manufacturing a circuit board
-
Application No.: US17331003Application Date: 2021-05-26
-
Publication No.: US11627668B2Publication Date: 2023-04-11
- Inventor: Yong-Chao Wei , Po-Yuan Chen
- Applicant: Avary Holding (Shenzhen) Co., Limited. , HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd. , GARUDA TECHNOLOGY CO., LTD.
- Applicant Address: CN Shenzhen; CN Qinhuangdao; TW New Taipei
- Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,GARUDA TECHNOLOGY CO., LTD.
- Current Assignee: Avary Holding (Shenzhen) Co., Limited.,HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd.,GARUDA TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Shenzhen; CN Qinhuangdao; TW New Taipei
- Agency: ScienBiziP, P.C.
- Priority: CN202110536265.3 20210517
- Main IPC: H05K3/46
- IPC: H05K3/46 ; H05K1/02 ; H05K3/34 ; H05K1/11
Abstract:
A circuit board includes a circuit substrate, a solder, and a surrounding portion. The circuit substrate includes a connecting pad. The solder is formed on a surface of the connecting pad. The surrounding portion is formed on the surface of the connecting pad and cooperates with the connecting pad to form a groove receiving the solder. The surrounding portion surrounds the solder and is spaced from the solder. A method for manufacturing a circuit board is also provided.
Public/Granted literature
- US20220369475A1 CIRCUIT BOARD, METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-11-17
Information query
