- Patent Title: Mattress top panel and mattress assemblies with improved airflow
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Application No.: US17511650Application Date: 2021-10-27
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Publication No.: US11627812B2Publication Date: 2023-04-18
- Inventor: Sang-hoon Lim , Andrea Piana
- Applicant: Tintoria Piana US, Inc.
- Applicant Address: US GA Cartersville
- Assignee: Tintoria Piana US, Inc.
- Current Assignee: Tintoria Piana US, Inc.
- Current Assignee Address: US GA Cartersville
- Agency: WCF IP
- Main IPC: A47C27/05
- IPC: A47C27/05

Abstract:
Vertically lapped nonwoven material is used to provide enhanced breathability and comfort in mattresses by replacing foam material in one or more of, including all of top panel quilts, layers underneath the top panel quilts, and in side blocks which surround spring supports. The vertically lapped nonwoven may provide advantages in terms of cost, manufacturing ease, robustness in mattress design, while at the same time providing the user with a much more comfortable sleeping experience.
Public/Granted literature
- US2648223A Method of testing the winding properties of filaments Public/Granted day:1953-08-11
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