Invention Grant
- Patent Title: Modular paneled structure having connective means to prevent gap opening and disconnection
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Application No.: US17197482Application Date: 2021-03-10
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Publication No.: US11629464B2Publication Date: 2023-04-18
- Inventor: Sung Woo Lee , Sangho Lee
- Applicant: Sung Woo Lee , Sangho Lee
- Applicant Address: KR Seoul; KR Seoul
- Assignee: Sung Woo Lee,Sangho Lee
- Current Assignee: Sung Woo Lee,Sangho Lee
- Current Assignee Address: KR Seoul; KR Seoul
- Agency: Goldilocks Zone IP Law
- Priority: KR10-2020-0049062 20200423
- Main IPC: E01D19/12
- IPC: E01D19/12 ; E01D101/24 ; E01D101/30

Abstract:
A modular paneled structure, comprising a main panel with a symmetric profile which has a closed-sectional portion in the middle and open-sectional portions at each end; and further comprising a cover panel which interconnects two side-by-side main panels, where the cover panel closes the open-sectional portions of the two side-by-side main panels forming a closed-sectional shape together with main panels; and further comprising a tensioning member which interconnects and pre-tensions the main panels that are placed side by side; and consequently, forms an assembled paneled structure with all these connective means, which is used to construct a paneled ground structures.
Public/Granted literature
- US20210332539A1 MODULAR PANELED STRUCTURE HAVING CONNECTIVE MEANS TO PREVENT GAP OPENING AND DISCONNECTION Public/Granted day:2021-10-28
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