Invention Grant
- Patent Title: Detection aided two-stage phase unwrapping on pattern wafer geometry measurement
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Application No.: US17825718Application Date: 2022-05-26
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Publication No.: US11629952B2Publication Date: 2023-04-18
- Inventor: Helen Liu , Guoqing Zhang , Hui Li
- Applicant: KLA Corporation
- Applicant Address: US CA Milpitas
- Assignee: KLA Corporation
- Current Assignee: KLA Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Suiter Swantz pc llo
- Main IPC: G01B11/02
- IPC: G01B11/02 ; G01B11/24

Abstract:
Systems and methods for unwrapping a phase map are disclosed. Such systems and methods may include receiving a wrapped phase map associated with an interferometric measurement of a sample including patterned features; removing a tilt from the wrapped phase map; generating a background; detecting features in the wrapped phase, the features in the wrapped phase map corresponding to least some of the patterned features of the sample; replacing phases of the features with the background at corresponding locations in the wrapped phase map; unwrapping the modified wrapped phase map using a global phase-unwrapping; applying local phase-unwrapping to restore the phases of the features; and reapplying the tilt to generate an output unwrapped phase map.
Public/Granted literature
- US20220390862A1 DETECTION AIDED TWO-STAGE PHASE UNWRAPPING ON PATTERN WAFER GEOMETRY MEASUREMENT Public/Granted day:2022-12-08
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