Invention Grant
- Patent Title: Method for sensing temperature in memory die, memory die and memory with temperature sensing function
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Application No.: US17169939Application Date: 2021-02-08
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Publication No.: US11630002B2Publication Date: 2023-04-18
- Inventor: Yuchih Yeh , Jianshing Liu , Chin Chu Chung , Nai-Ping Kuo , Shihchou Juan
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. Patents
- Main IPC: G01K3/00
- IPC: G01K3/00 ; G06F13/16 ; G11C16/04

Abstract:
A method for sensing temperature in memory die, memory die and memory with temperature sensing function are provides. The memory die includes at least one temperature monitoring for outputting a temperature status in the memory die; a temperature sensor, arranged in the memory die for sensing an operation temperature in the memory die; and a control logic unit, coupled to the temperature sensor for receiving the operation temperature and coupled to the temperature monitoring pin. The control logic unit compares the operation temperature and a threshold value received from outside of the memory die to generate a comparison result, and outputs the temperature status through the temperature monitoring according to the comparison result.
Public/Granted literature
- US20220252460A1 METHOD FOR SENSING TEMPERATURE IN MEMORY DIE, MEMORY DIE AND MEMORY WITH TEMPERATURE SENSING FUNCTION Public/Granted day:2022-08-11
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