Invention Grant
- Patent Title: Substrate processing apparatus
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Application No.: US16666717Application Date: 2019-10-29
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Publication No.: US11630392B2Publication Date: 2023-04-18
- Inventor: Tsunenaga Nakashima
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Pearne & Gordon LLP
- Priority: JP2013-211066 20131008,JP2013-211079 20131008
- Main IPC: G03F7/30
- IPC: G03F7/30 ; G03F7/16 ; H01L21/67 ; H01L21/677

Abstract:
In a chemical liquid container replacement device D2 configured to replace a chemical liquid container 50, multiple chemical liquid containers 50 respectively connected to base end sides of chemical liquid supply paths configured to supply chemical liquids, and a nozzle attachment/detachment device 61 is configured to attach/detach the base end side of the chemical liquid supply path with respect to the chemical liquid container 50 of a container arrangement section 60. A loading/unloading port 62 loads a new chemical liquid container 50 for performing a liquid process on a substrate W and unloads a completely used chemical liquid container 50. A container transfer device 7 unloads the completely used chemical liquid container 50 from the container arrangement section 60 toward the loading/unloading port 62 and loads the new chemical liquid containers 50 from the loading/unloading port 62 toward the container arrangement section 60.
Public/Granted literature
- US20200064741A1 SUBSTRATE PROCESSING APPARATUS Public/Granted day:2020-02-27
Information query
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