Invention Grant
- Patent Title: Determining a cut pattern of a lathe method, control device, and lathe
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Application No.: US17784033Application Date: 2019-12-13
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Publication No.: US11630438B2Publication Date: 2023-04-18
- Inventor: Sebastian Brake , Reinhard Rinas
- Applicant: Siemens Industry Software Inc.
- Applicant Address: US TX Plano
- Assignee: Siemens Industry Software Inc.
- Current Assignee: Siemens Industry Software Inc.
- Current Assignee Address: US TX Plano
- Agency: Lempia Summerfield Katz LLC
- International Application: PCT/US2019/066319 WO 20191213
- International Announcement: WO2021/118603 WO 20210617
- Main IPC: G05B19/4093
- IPC: G05B19/4093

Abstract:
A computer-implemented method is provided for determining a cut pattern of a lathe. The lathe is numerically controlled by a control device and includes a tool with a cutter acting on a workpiece. The workpiece has a start contour and a target contour to be achieved by cutting the workpiece according to the cut pattern. The method includes determining a path of a n-th layer of the cut pattern, wherein the n-th layer includes: for n≥2: an infeed path linear and/or parallel to the target contour; a circular infeed path starting tangent to the target contour; an intermediate path linear and/or parallel to the target contour; a circular outfeed path ending tangent to the target contour; and for n≥2: a smoothing path linear and/or parallel to the target contour.
Public/Granted literature
- US20230012457A1 DETERMINING A CUT PATTERN OF A LATHE METHOD, CONTROL DEVICE, AND LATHE Public/Granted day:2023-01-12
Information query
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