Invention Grant
- Patent Title: Wire disconnection prediction device
-
Application No.: US16659908Application Date: 2019-10-22
-
Publication No.: US11630440B2Publication Date: 2023-04-18
- Inventor: Masanobu Takemoto , Keita Hada
- Applicant: FANUC Corporation
- Applicant Address: JP Yamanashi
- Assignee: FANUC Corporation
- Current Assignee: FANUC Corporation
- Current Assignee Address: JP Yamanashi
- Agency: Hauptman Ham, LLP
- Priority: JPJP2018-210344 20181108
- Main IPC: G05B19/4155
- IPC: G05B19/4155 ; G06N20/00 ; B23H7/20 ; B23H11/00

Abstract:
A wire disconnection prediction device includes: a data acquisition part configured to acquire data relating to machining of a workpiece in a state where a wire is not disconnected during machining of the workpiece by a wire electric discharge machine; a preprocessing part configured to create, machining condition data of a condition relating to a machining condition commanded in machining of the workpiece, machining member data relating to a member used in the machining, and machining state data during machining of the workpiece, as state data indicating a state of the machining; and a learning part configured to generate, based on the state data created by the preprocessing part, a learning model indicating correlation between the state data and the state where the wire of the wire electric discharge machine is not disconnected.
Public/Granted literature
- US20200150632A1 WIRE DISCONNECTION PREDICTION DEVICE Public/Granted day:2020-05-14
Information query
IPC分类: