Invention Grant
- Patent Title: Monolithically integrated system on chip for silicon photonics
-
Application No.: US17751212Application Date: 2022-05-23
-
Publication No.: US11630799B2Publication Date: 2023-04-18
- Inventor: Radhakrishnan L. Nagarajan , Chao Xu
- Applicant: Marvell Asia Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: Marvell Asia Pte Ltd.
- Current Assignee: Marvell Asia Pte Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: G06F15/78
- IPC: G06F15/78 ; G06F13/42 ; G02B6/12 ; H04B10/80 ; H04B10/40 ; H04B10/69 ; H04L27/00 ; G06F13/364 ; G06F13/40 ; H04L1/00 ; H04L25/03 ; H04L5/14 ; H04L27/02 ; H04L27/18 ; H04L27/34

Abstract:
A hybrid electrical and optic system-on-chip (SOC) device configured for both electrical and optic communication includes a substrate, an electrical device configured for electrical communication arranged on the substrate, a photonics device configured for optic communication arranged on the substrate, and a self-test module arranged on the substrate. The self-test module is configured to receive a loop-back signal indicative of an optical signal output from the photonics device and calibrate the photonics device based on the loop-back signal.
Public/Granted literature
- US20220283982A1 MONOLITHICALLY INTEGRATED SYSTEM ON CHIP FOR SILICON PHOTONICS Public/Granted day:2022-09-08
Information query