Invention Grant
- Patent Title: Segmentation of an image of a semiconductor specimen
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Application No.: US16917692Application Date: 2020-06-30
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Publication No.: US11631179B2Publication Date: 2023-04-18
- Inventor: Elad Ben Baruch , Shalom Elkayam , Shaul Cohen , Tal Ben-Shlomo
- Applicant: Applied Materials Israel Ltd.
- Applicant Address: IL Rehovot
- Assignee: Applied Materials Israel Ltd.
- Current Assignee: Applied Materials Israel Ltd.
- Current Assignee Address: IL Rehovot
- Agency: Lowenstein Sandler LLP
- Main IPC: G06N20/00
- IPC: G06N20/00 ; G06T7/11 ; G06T7/187 ; G06F17/18 ; G06F30/27

Abstract:
There is provided a system and method of segmenting an image of a fabricated semiconductor specimen. The method includes: obtaining a first probability map corresponding to the image representative of at least a portion of the fabricated semiconductor specimen and indicative of predicted probabilities of pixels in the image to correspond to one or more first structural elements presented in the image, obtaining a first label map informative of one or more segments representative of second structural elements and labels associated with the segments, performing simulation on the first label map to obtain a second probability map indicative of simulated probabilities of pixels in the first label map to correspond to the one or more segments, and generating a second label map based on the first probability map and the second probability map, the second label map being usable for segmentation of the image with enhanced repeatability.
Public/Granted literature
- US20210407093A1 SEGMENTATION OF AN IMAGE OF A SEMICONDUCTOR SPECIMEN Public/Granted day:2021-12-30
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