Invention Grant
- Patent Title: 8-shaped inductive coil device
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Application No.: US16155058Application Date: 2018-10-09
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Publication No.: US11631517B2Publication Date: 2023-04-18
- Inventor: Hsiao-Tsung Yen , Yuh-Sheng Jean , Ta-Hsun Yeh
- Applicant: Realtek Semiconductor Corporation
- Applicant Address: TW Hsinchu
- Assignee: Realtek Semiconductor Corporation
- Current Assignee: Realtek Semiconductor Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Locke Lord LLP
- Agent Tim Tingkang Xia, Esq.
- Priority: TW107101443 20180115
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/00 ; H01L49/02 ; H01F27/29 ; H01F17/00

Abstract:
An 8-shaped inductive coil device that includes a first and a second spiral coils and a connection segment structure is provided. The first spiral coil includes first metal segments and crossing connection segments disposed at a first and a second metal layers respectively and includes first connection terminals. The second spiral coil includes second connection terminals. The connection segment structure electrically couples the first and the second connection terminals. The first and the second spiral coils are disposed along an imaginary line passing through a central region of each of ranges surrounded by the first and the second spiral coils. The connection segment structure and the crossing connection segments electrically couple the part of the first metal segments substantially vertical to the imaginary line, and the connection segment structure and the crossing connection segments are disposed substantially on the imaginary line.
Public/Granted literature
- US20190221350A1 8-SHAPED INDUCTIVE COIL DEVICE Public/Granted day:2019-07-18
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