Invention Grant
- Patent Title: High current swing-type inductor and methods of fabrication
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Application No.: US16600704Application Date: 2019-10-14
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Publication No.: US11631520B2Publication Date: 2023-04-18
- Inventor: Yipeng Yan , Dengyan Zhou , Jinliang Xu , Jin Lu
- Applicant: EATON INTELLIGENT POWER LIMITED
- Applicant Address: IE Dublin
- Assignee: EATON INTELLIGENT POWER LIMITED
- Current Assignee: EATON INTELLIGENT POWER LIMITED
- Current Assignee Address: IE Dublin
- Agency: Baker Botts L.L.P.
- Main IPC: H01F27/26
- IPC: H01F27/26 ; H01F27/28

Abstract:
An electromagnetic component assembly includes a first magnetic core piece, a second magnetic core piece, and an inverted U-shaped conductive winding including a base section and first and second legs extending from base section. One of the first and second magnetic core pieces is configured to receive the base section. The first and second magnetic core pieces are gapped from one another to define a first gap, and one of the first and second magnetic core pieces includes a second gap that, in combination with the first gap, allows the component to be operated at more than one stable open circuit inductance (OCL) corresponding to different current loads.
Public/Granted literature
- US20200043643A1 HIGH CURRENT SWING-TYPE INDUCTOR AND METHODS OF FABRICATION Public/Granted day:2020-02-06
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