Invention Grant
- Patent Title: Coil component and method of manufacturing the same
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Application No.: US16893826Application Date: 2020-06-05
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Publication No.: US11631522B2Publication Date: 2023-04-18
- Inventor: Young Min Hur , Dong Ho Han , Boum Seock Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0101941 20190820,KR10-2019-0118705 20190926
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F41/04

Abstract:
A coil component includes a support substrate, a coil portion including a first conductive layer being in contact with one surface of the support substrate, and a second conductive layer disposed on the first conductive layer to be spaced apart from the one surface of the support substrate, and a body including the support substrate and the coil portion embedded in the body. One side of the first conductive layer is closer to a center of the second conductive layer in a width direction of the coil portion than one side of the second conductive layer.
Public/Granted literature
- US20210057142A1 COIL COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2021-02-25
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