Invention Grant
- Patent Title: Coil component
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Application No.: US16566255Application Date: 2019-09-10
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Publication No.: US11631531B2Publication Date: 2023-04-18
- Inventor: Jong Ik Park
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0037735 20190401
- Main IPC: H01F27/32
- IPC: H01F27/32 ; H01F27/34 ; H01F27/29

Abstract:
A coil component is provided. The coil component includes a body having one surface and the other surface, opposing each other, and including a plurality of wall surfaces respectively connecting the one surface and the other surface, a coil portion embedded in the body, first and second external electrodes spaced apart from each other on one surface of the body, and respectively connected to the coil portion, a groove formed continuously along an edge of the other surface of the body, and a stress relieving portion disposed on the other surface of the body to fill at least a portion of the groove.
Public/Granted literature
- US20200312536A1 COIL COMPONENT Public/Granted day:2020-10-01
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