Invention Grant
- Patent Title: Formulation for deposition of silicon doped hafnium oxide as ferroelectric materials
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Application No.: US17375996Application Date: 2021-07-14
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Publication No.: US11631580B2Publication Date: 2023-04-18
- Inventor: Xinjian Lei , Matthew R. MacDonald , Moo-Sung Kim , Se-Won Lee
- Applicant: VERSUM MATERIALS US, LLC
- Applicant Address: US AZ Tempe
- Assignee: VERSUM MATERIALS US, LLC
- Current Assignee: VERSUM MATERIALS US, LLC
- Current Assignee Address: US AZ Tempe
- Agent Daniel A. DeMarah, Jr.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; C23C16/40 ; C23C16/455 ; C23C16/50 ; C09D5/24 ; C09D1/00 ; H01L49/02 ; H01L27/11507 ; C09D7/40

Abstract:
In one aspect, the invention is formulations comprising both organoaminohafnium and organoaminosilane precursors that allows anchoring both silicon-containing fragments and hafnium-containing fragments onto a given surface having hydroxyl groups to deposit silicon doped hafnium oxide having a silicon doping level ranging from 0.5 to 8 mol %, preferably 2 to 6 mol %, most preferably 3 to 5 mol %, suitable as ferroelectric material. In another aspect, the invention is methods and systems for depositing the silicon doped hafnium oxide films using the formulations.
Public/Granted literature
- US20220189767A1 FORMULATION FOR DEPOSITION OF SILICON DOPED HAFNIUM OXIDE AS FERROELECTRIC MATERIALS Public/Granted day:2022-06-16
Information query
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