Invention Grant
- Patent Title: Sealed substrate carriers and systems and methods for transporting substrates
-
Application No.: US16716963Application Date: 2019-12-17
-
Publication No.: US11631605B2Publication Date: 2023-04-18
- Inventor: Michael Robert Rice , Jeffrey C. Hudgens
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Lowenstein Sandler LLP
- Main IPC: H01L21/677
- IPC: H01L21/677 ; H01L21/673 ; B65D85/00

Abstract:
A semiconductor processing system includes a first component and a second component. The first component forms a first chamber with a first sealed environment at a first state within the first chamber. The second component is coupled to the first component. The second component forms a second chamber with a second sealed environment at a second state within the second chamber. A third component is to change the first state of the first sealed environment within the first chamber to cause the first state to be substantially similar to the second state of the second sealed environment within the second chamber. The second sealed environment is at the second state prior to changing of the first state of the first sealed environment to be substantially similar to the second state.
Information query
IPC分类: