Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17452069Application Date: 2021-10-25
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Publication No.: US11631665B2Publication Date: 2023-04-18
- Inventor: Yuichi Harada
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JPJP2017-221127 20171116,JPJP2018-113413 20180614
- Main IPC: H01L27/06
- IPC: H01L27/06 ; H01L29/06 ; H01L29/08 ; H01L29/10 ; H01L29/40 ; H01L29/739 ; H01L29/861

Abstract:
Provided is a semiconductor device comprising a semiconductor substrate that includes a transistor region; an emitter electrode that is provided on the semiconductor substrate; a first dummy trench portion that is provided on the transistor region of the semiconductor substrate and includes a dummy conducting portion that is electrically connected to the emitter electrode; and a first contact portion that is a partial region of the transistor region, provided between an end portion of a long portion of the first dummy trench portion and an end portion of the semiconductor substrate, and electrically connects the emitter electrode and a semiconductor region with a first conductivity type provided in the transistor region.
Information query
IPC分类: