Invention Grant
- Patent Title: Memory arrays comprising memory cells
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Application No.: US17328776Application Date: 2021-05-24
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Publication No.: US11631678B2Publication Date: 2023-04-18
- Inventor: Sanh D. Tang , Martin C. Roberts , Gurtej S. Sandhu
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; H01L29/786

Abstract:
Some embodiments include a memory array having vertically-stacked memory cells. Each of the memory cells includes a transistor coupled with a charge-storage device, and each of the transistors has channel material with a bandgap greater than 2 electron-volts. Some embodiments include a memory array having digit lines extending along a vertical direction and wordlines extending along a horizontal direction. The memory array includes memory cells, with each of the memory cells being uniquely addressed by combination of one of the digit lines and one of the wordlines. Each of the memory cells includes a transistor which has GaP channel material. Each of the transistors has first and second source/drain regions spaced from one another by the GaP channel material. The first source/drain regions are coupled with the digit lines, and each of the memory cells includes a capacitor coupled with the second source/drain region of the associated transistor. Other embodiments are disclosed.
Public/Granted literature
- US20210280586A1 Memory Arrays Comprising Memory Cells Public/Granted day:2021-09-09
Information query
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