Invention Grant
- Patent Title: Light emitting device
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Application No.: US17485506Application Date: 2021-09-27
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Publication No.: US11631789B2Publication Date: 2023-04-18
- Inventor: Yuichi Yamada , Motokazu Yamada
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Mori & Ward, LLP
- Priority: JP2015-249237 20151222
- Main IPC: H01L33/46
- IPC: H01L33/46 ; H01L33/48 ; H01L33/50 ; H01L33/58 ; H01L33/62 ; H01L33/54 ; H01L33/60

Abstract:
A light emitting device includes a base including a support having a support surface. A light emitting element includes a semiconductor layer and a sapphire substrate provided on the semiconductor layer opposite to the support surface. A reflecting film provided on the sapphire substrate. A light-transmissive covering member is provided on the support surface. A height of the light-transmissive covering member viewed in a direction in which a width of the light-transmissive covering member appears smallest is 0.5 times or less of the width of the light-transmissive covering member. A light reflecting layer is provided on a first region of the base such that a first reflectivity in the first region of the base being higher than a second reflectivity in a second region of the base, the second region overlapping with the light emitting element and being surrounded by the first region as viewed in the height direction.
Public/Granted literature
- US20220013694A1 LIGHT EMITTING DEVICE Public/Granted day:2022-01-13
Information query
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