A control device includes a first substrate provided with a chip electronic component; a second substrate having a surface provided with electronic components including a tall component taller than the chip electronic component, the surface of the second substrate facing a surface of the first substrate that is provided with the chip electronic component; and a heat sink disposed between the first substrate and the second substrate. The heat sink includes a component receiving portion and a heat dissipation portion, the component receiving portion being configured to receive the tall component, the heat dissipation portion being configured to perform heat exchange between the first substrate and the second substrate, and the component receiving portion and the heat dissipation portion being provided so as not to overlap with each other as viewed in a facing direction in which the first substrate and the second substrate face each other.