Disclosed herein is a semiconductor device configured by packaging a semiconductor chip, including at least one terminal. The semiconductor chip includes a pad connected to the terminal, a voltage clamp unit, and a wiring disposed along an outer periphery of the semiconductor chip and between the voltage clamp unit and the pad. In a case in which the wiring has no broken wire portion, a terminal voltage generated at the terminal is clamped to a clamp voltage by the voltage clamp unit, and in a case in which the wiring has a broken wire portion, the terminal voltage reaches a predetermined voltage higher than the clamp voltage or a predetermined voltage lower than the clamp voltage.