Invention Grant
- Patent Title: Polyphase filter with interphase coupling
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Application No.: US17211716Application Date: 2021-03-24
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Publication No.: US11632098B2Publication Date: 2023-04-18
- Inventor: Timothy Donald Gathman , Lai Kan Leung , Chirag Dipak Patel , Xinmin Yu , Rajagopalan Rangarajan
- Applicant: Qualcomm Incorporated
- Applicant Address: US CA San Diego
- Assignee: Qualcomm Incorporated
- Current Assignee: Qualcomm Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Colby Nipper/Qualcomm
- Main IPC: H03H11/22
- IPC: H03H11/22 ; H03H11/04

Abstract:
An example apparatus includes a polyphase transconductance-capacitor filter. The polyphase filter includes a DC bias voltage node, a plus in-phase filter unit, a minus in-phase filter unit, a plus quadrature-phase filter unit, and a minus quadrature-phase filter unit. Each filter unit respectively includes an input node, an output node, and a control node. The polyphase filter also includes a plus in-phase switch and a minus in-phase switch. The plus in-phase switch is coupled to the control node of the plus in-phase filter unit, the DC bias voltage node, and the input node of one or both of the plus quadrature-phase filter unit and the minus quadrature-phase filter unit. The minus in-phase switch is coupled to the control node of the minus in-phase filter unit, the DC bias voltage node, and the input node of one or both of the plus quadrature-phase filter unit and the minus quadrature-phase filter unit.
Public/Granted literature
- US20220311423A1 Polyphase Filter with Interphase Coupling Public/Granted day:2022-09-29
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