Invention Grant
- Patent Title: Camera module, camera, and cable connection method for camera module
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Application No.: US16981019Application Date: 2019-04-04
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Publication No.: US11632490B2Publication Date: 2023-04-18
- Inventor: Takashi Kubara , Yosuke Kawauchi , Yuichi Hatase
- Applicant: PANASONIC I-PRO SENSING SOLUTIONS CO., LTD.
- Applicant Address: JP Fukuoka
- Assignee: PANASONIC I-PRO SENSING SOLUTIONS CO., LTD.
- Current Assignee: PANASONIC I-PRO SENSING SOLUTIONS CO., LTD.
- Current Assignee Address: JP Fukuoka
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JPJP2018-074004 20180406
- International Application: PCT/JP2019/015032 WO 20190404
- International Announcement: WO2019/194295 WO 20191010
- Main IPC: H04N5/374
- IPC: H04N5/374 ; H04N5/225 ; A61B1/00 ; A61B1/05 ; H04N7/18

Abstract:
A camera module is provided with: an imaging element which is formed in a rectangular shape and has a plurality of pads provided to a back surface opposite from an imaging surface; a substrate where, on the same plane, a plurality of linear conductors are lined up in parallel and have an insulating coating in a rectangular shape such that the side of one end and the other end in the direction of extension of the conductors is shorter than one side of the imaging element, the conductors at the one end and the other end being exposed at a plate surface front and/or back; and a low-melting-point electroconductive material for connecting, to each of the pads, the conductors of the one end that are exposed due to one end surface of the substrate being abutted against the back surface.
Public/Granted literature
- US20210021740A1 CAMERA MODULE, CAMERA, AND CABLE CONNECTION METHOD FOR CAMERA MODULE Public/Granted day:2021-01-21
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