Invention Grant
- Patent Title: Method of manufacturing electronic module, electronic module, and electronic device
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Application No.: US17065026Application Date: 2020-10-07
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Publication No.: US11632886B2Publication Date: 2023-04-18
- Inventor: Mitsutoshi Hasegawa
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: CANON KABUSHIKI KAISHA
- Current Assignee: CANON KABUSHIKI KAISHA
- Current Assignee Address: JP Tokyo
- Agency: Venable LLP
- Priority: JPJP2019-201679 20191106
- Main IPC: H01L21/304
- IPC: H01L21/304 ; H01L23/10 ; H01L23/24 ; H01L23/498 ; H01L25/03 ; H01L25/16 ; H05K13/04 ; H01L23/00 ; H01L21/50 ; H01L21/48 ; H01L27/146 ; H05K3/34 ; H01L21/60
Abstract:
A method of manufacturing an electronic module includes supplying paste to an electronic component and/or a wiring board. The paste includes solder powder and first resin. The method includes supplying second resin to the electronic component and/or the wiring board. The method includes placing one of the electronic component and the wiring board on another. The method includes curing the second resin to form a second resin portion. The method includes heating the paste to a temperature equal to or higher than a solder melting point after the second resin portion is formed. The method includes solidifying molten solder at a temperature lower than the solder melting point to form a solder portion that bonds the electronic component and the wiring board. The method includes curing the first resin after the solder portion is formed, to form a first resin portion.
Public/Granted literature
- US20210136967A1 METHOD OF MANUFACTURING ELECTRONIC MODULE, ELECTRONIC MODULE, AND ELECTRONIC DEVICE Public/Granted day:2021-05-06
Information query
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