Invention Grant
- Patent Title: Silicon carbide semiconductor device
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Application No.: US17307648Application Date: 2021-05-04
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Publication No.: US11637182B2Publication Date: 2023-04-25
- Inventor: Takumi Fujimoto
- Applicant: FUJI ELECTRIC CO., LTD.
- Applicant Address: JP Kawasaki
- Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee: FUJI ELECTRIC CO., LTD.
- Current Assignee Address: JP Kawasaki
- Priority: JPJP2017-228293 20171128
- Main IPC: H01L29/08
- IPC: H01L29/08 ; H01L29/78 ; H01L29/16 ; H01L29/66 ; H01L29/739 ; H01L21/04

Abstract:
A silicon carbide semiconductor device includes a semiconductor substrate, a first semiconductor layer, a second semiconductor layer, a first semiconductor region, and a gate electrode. Protons are implanted in a first region spanning a predetermined distance from a surface of the semiconductor substrate facing toward the first semiconductor layer, in a second region spanning a predetermined distance from a surface of the first semiconductor layer on the second side of the first semiconductor layer facing toward the semiconductor substrate, in a third region spanning a predetermined distance from a surface of the first semiconductor layer on the first side of the first semiconductor layer facing toward the second semiconductor layer, and in a fourth region spanning a predetermined distance from a surface of the second semiconductor layer on the second side of the second semiconductor layer facing toward the first semiconductor layer.
Public/Granted literature
- US20210257455A1 SILICON CARBIDE SEMICONDUCTOR DEVICE Public/Granted day:2021-08-19
Information query
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