Invention Grant
- Patent Title: Method of forming a semiconductor transistor having an epitaxial channel layer
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Application No.: US17670521Application Date: 2022-02-14
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Publication No.: US11637183B2Publication Date: 2023-04-25
- Inventor: Sheng-Hsu Liu , Shih-Hsien Huang , Wen Yi Tan
- Applicant: United Semiconductor (Xiamen) Co., Ltd.
- Applicant Address: CN Fujian
- Assignee: United Semiconductor (Xiamen) Co., Ltd.
- Current Assignee: United Semiconductor (Xiamen) Co., Ltd.
- Current Assignee Address: CN Fujian
- Agent Winston Hsu
- Priority: CN202010079601.1 20200204
- Main IPC: H01L29/10
- IPC: H01L29/10 ; H01L21/762 ; H01L29/66 ; H01L29/161

Abstract:
A method for fabricating a semiconductor transistor is disclosed. A substrate of a first conductivity type is provided. An ion well of a second conductivity type is formed in the substrate. An epitaxial channel layer of the first conductivity type is grown from the main surface of the substrate. A gate dielectric layer is formed on the epitaxial channel layer. A gate is formed on the gate dielectric layer. A source region and a drain region are then formed in the substrate. The source region and the drain region have the first conductivity type.
Public/Granted literature
- US20220165849A1 SEMICONDUCTOR TRANSISTOR AND FABRICATION METHOD THEREOF Public/Granted day:2022-05-26
Information query
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