Invention Grant
- Patent Title: Semiconductor device and manufacturing method of the same
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Application No.: US17383423Application Date: 2021-07-22
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Publication No.: US11637203B2Publication Date: 2023-04-25
- Inventor: Yu-Feng Yin , Chia-Jung Yu , Pin-Cheng Hsu , Chung-Te Lin
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/51 ; H01L29/66 ; H01L29/10 ; H01L29/08

Abstract:
A semiconductor device includes a transistor. The transistor includes a gate electrode, a channel layer, a gate dielectric layer, a first source/drain region and a second source/drain region and a first spacer. The channel layer is disposed on the gate electrode. The gate dielectric layer is located between the channel layer and the gate electrode. The first source/drain region and the second source/drain region are disposed on the channel layer at opposite sides of the gate electrode, and at least one of the first and second source/drain regions includes a first portion and a second portion between the first portion and the gate electrode. The first spacer is disposed on the channel layer. The first spacer is disposed on a first sidewall of the second portion of the at least one of the first and second source/drain regions, and the first portion is disposed on the first spacer.
Public/Granted literature
- US20230024174A1 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME Public/Granted day:2023-01-26
Information query
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