- Patent Title: OFDM packing and LDPC framing for constellation shaping in NG WLANs
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Application No.: US16998528Application Date: 2020-08-20
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Publication No.: US11637654B2Publication Date: 2023-04-25
- Inventor: Yaron Yoffe , Assaf Gurevitz , Elad Meir , Shlomi Vituri , Qinghua Li , Xiaogang Chen , Feng Jiang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H03M13/00
- IPC: H03M13/00 ; H04L1/00 ; H03M13/25 ; H03M13/11 ; H04L5/00 ; H04L27/26

Abstract:
An apparatus for a station (STA) configured for operating in a next-generation (NG) wireless local area network (WLAN) comprises the processing circuitry configured to modify probabilities of constellation points to generate a more Gaussian distribution. In these embodiments, for LDPC framing and OFDM packing, the transmitter circuitry may be configured to compute a number of output bits (bout) to be transmitted based on a number of payload bits (bin) at an output of a shaping encoder, a shaping rate (rshaping), and an overhead percent (Boverhead). A shaping gain of up to 1.53 dB may be achieved. A new shaping encoder is provided to address the issue that the number of bits is not fixed.
Public/Granted literature
- US20200382139A1 OFDM PACKING AND LDPC FRAMING FOR CONSTELLATION SHAPING IN NG WLANS Public/Granted day:2020-12-03
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