Invention Grant
- Patent Title: Co-packaged multiplane networks
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Application No.: US17047833Application Date: 2018-04-30
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Publication No.: US11637719B2Publication Date: 2023-04-25
- Inventor: Nicholas McDonald , Gary Gostin , Alan Davis
- Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Applicant Address: US TX Houston
- Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP
- Current Assignee Address: US TX Houston
- Agency: Hewlett Packard Enterprise Patent Department
- International Application: PCT/US2018/030111 WO 20180430
- International Announcement: WO2019/212461 WO 20191107
- Main IPC: H04L12/28
- IPC: H04L12/28 ; H04L12/42 ; H04L12/403 ; H04L41/12

Abstract:
A co-packaged, multiplane network includes: an enclosure; a portion of a first network plane disposed within the enclosure and comprising a first plurality of interconnected switches; a portion of a second network plane disposed within the enclosure and comprising a second plurality of interconnected switches, the second network plane being independent of the first network plane and having the same topology as the first network plane; and a plurality of connectors, each connector being communicatively coupled to a respective port of each of the first plurality of interconnected switches and the second plurality of interconnected switches.
Public/Granted literature
- US20210167992A1 CO-PACKAGED MULTIPLANE NETWORKS Public/Granted day:2021-06-03
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